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v1.3f some changes to the schematic

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This commit is contained in:
Stepan Usatiuk
2019-08-05 18:42:35 +03:00
parent 1be3dce80d
commit cfbfac6cb7
5 changed files with 27 additions and 27 deletions
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4
Electronics/EggbotWireless/EggbotWireless.bak
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@@ -364,7 +364,7 @@ L EggbotWireless-rescue:L-Device L1
U 1 1 5CEC224D U 1 1 5CEC224D
P 9450 4450 P 9450 4450
F 0 "L1" V 9400 4450 50 0000 C CNN F 0 "L1" V 9400 4450 50 0000 C CNN
F 1 "3.3uH" V 9300 4450 50 0000 C CNN F 1 "6.8uH" V 9300 4450 50 0000 C CNN
F 2 "Inductor_SMD:L_7.3x7.3_H4.5" H 9450 4450 50 0001 C CNN F 2 "Inductor_SMD:L_7.3x7.3_H4.5" H 9450 4450 50 0001 C CNN
F 3 "~" H 9450 4450 50 0001 C CNN F 3 "~" H 9450 4450 50 0001 C CNN
1 9450 4450 1 9450 4450
@@ -1755,7 +1755,7 @@ L EggbotWireless-rescue:R-Device-Catfi-rescue R21
U 1 1 5D2AE9C7 U 1 1 5D2AE9C7
P 4900 1500 P 4900 1500
F 0 "R21" V 4693 1500 50 0000 C CNN F 0 "R21" V 4693 1500 50 0000 C CNN
F 1 "330" V 4784 1500 50 0000 C CNN F 1 "510" V 4784 1500 50 0000 C CNN
F 2 "Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder" V 4830 1500 50 0001 C CNN F 2 "Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder" V 4830 1500 50 0001 C CNN
F 3 "~" H 4900 1500 50 0001 C CNN F 3 "~" H 4900 1500 50 0001 C CNN
1 4900 1500 1 4900 1500

12
Electronics/EggbotWireless/EggbotWireless.kicad_pcb
View File

@@ -1,4 +1,4 @@
(kicad_pcb (version 20171130) (host pcbnew 5.1.2-5.1.2) (kicad_pcb (version 20171130) (host pcbnew 5.1.2-1.fc30)
(general (general
(thickness 1.6) (thickness 1.6)
@@ -735,7 +735,7 @@
(fp_text reference R27 (at 0 -1.65 90) (layer F.SilkS) (fp_text reference R27 (at 0 -1.65 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text value 3K (at 0 1.65 90) (layer F.Fab) (fp_text value 2.2K (at 0 1.65 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text user %R (at 0 0 90) (layer F.Fab) (fp_text user %R (at 0 0 90) (layer F.Fab)
@@ -1313,7 +1313,7 @@
(fp_text reference R21 (at -3.15 0.3 180) (layer F.SilkS) (fp_text reference R21 (at -3.15 0.3 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text value 330 (at 0 1.65) (layer F.Fab) (fp_text value 510 (at 0 1.65) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text user %R (at 0 0) (layer F.Fab) (fp_text user %R (at 0 0) (layer F.Fab)
@@ -3709,7 +3709,7 @@
(gr_line (start 137.364 77.528) (end 19.364 77.528) (layer Edge.Cuts) (width 0.05)) (gr_line (start 137.364 77.528) (end 19.364 77.528) (layer Edge.Cuts) (width 0.05))
(gr_line (start 137.364 37.528) (end 137.364 77.528) (layer Edge.Cuts) (width 0.05)) (gr_line (start 137.364 37.528) (end 137.364 77.528) (layer Edge.Cuts) (width 0.05))
(gr_line (start 19.364 37.528) (end 137.364 37.528) (layer Edge.Cuts) (width 0.05)) (gr_line (start 19.364 37.528) (end 137.364 37.528) (layer Edge.Cuts) (width 0.05))
(gr_text "Eggbot Wireless v1.3" (at 29.764 75.128) (layer F.SilkS) (tstamp 5D0BB958) (gr_text "Eggbot Wireless v1.3f" (at 29.764 75.128) (layer F.SilkS) (tstamp 5D0BB958)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify left)) (effects (font (size 1.5 1.5) (thickness 0.3)) (justify left))
) )
@@ -4709,7 +4709,7 @@
(via (at 110.472 56.292) (size 0.8) (drill 0.4) (layers F.Cu B.Cu) (net 72)) (via (at 110.472 56.292) (size 0.8) (drill 0.4) (layers F.Cu B.Cu) (net 72))
(segment (start 110.472 56.292) (end 110.928 56.292) (width 2) (layer B.Cu) (net 72)) (segment (start 110.472 56.292) (end 110.928 56.292) (width 2) (layer B.Cu) (net 72))
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5D0BEF9A) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5D484675) (hatch edge 0.508)
(connect_pads (clearance 0.2)) (connect_pads (clearance 0.2))
(min_thickness 0.2) (min_thickness 0.2)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -6479,7 +6479,7 @@
) )
) )
) )
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5D0BEF97) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5D484672) (hatch edge 0.508)
(connect_pads (clearance 0.2)) (connect_pads (clearance 0.2))
(min_thickness 0.254) (min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))

12
Electronics/EggbotWireless/EggbotWireless.kicad_pcb-bak
View File

@@ -1,4 +1,4 @@
(kicad_pcb (version 20171130) (host pcbnew 5.1.2-5.1.2) (kicad_pcb (version 20171130) (host pcbnew 5.1.2-1.fc30)
(general (general
(thickness 1.6) (thickness 1.6)
@@ -735,7 +735,7 @@
(fp_text reference R27 (at 0 -1.65 90) (layer F.SilkS) (fp_text reference R27 (at 0 -1.65 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text value 3K (at 0 1.65 90) (layer F.Fab) (fp_text value 2.2K (at 0 1.65 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text user %R (at 0 0 90) (layer F.Fab) (fp_text user %R (at 0 0 90) (layer F.Fab)
@@ -1313,7 +1313,7 @@
(fp_text reference R21 (at -3.15 0.3 180) (layer F.SilkS) (fp_text reference R21 (at -3.15 0.3 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text value 330 (at 0 1.65) (layer F.Fab) (fp_text value 510 (at 0 1.65) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text user %R (at 0 0) (layer F.Fab) (fp_text user %R (at 0 0) (layer F.Fab)
@@ -3220,7 +3220,7 @@
(fp_text reference L1 (at -2.825 -4.575) (layer F.SilkS) (fp_text reference L1 (at -2.825 -4.575) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_text value 3.3uH (at 0 4.45) (layer F.Fab) (fp_text value 6.8uH (at 0 4.45) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15))) (effects (font (size 1 1) (thickness 0.15)))
) )
(fp_arc (start 0 0) (end -2.29 -2.29) (angle 90) (layer F.Fab) (width 0.1)) (fp_arc (start 0 0) (end -2.29 -2.29) (angle 90) (layer F.Fab) (width 0.1))
@@ -4709,7 +4709,7 @@
(via (at 110.472 56.292) (size 0.8) (drill 0.4) (layers F.Cu B.Cu) (net 72)) (via (at 110.472 56.292) (size 0.8) (drill 0.4) (layers F.Cu B.Cu) (net 72))
(segment (start 110.472 56.292) (end 110.928 56.292) (width 2) (layer B.Cu) (net 72)) (segment (start 110.472 56.292) (end 110.928 56.292) (width 2) (layer B.Cu) (net 72))
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5D0BEF9A) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5D484675) (hatch edge 0.508)
(connect_pads (clearance 0.2)) (connect_pads (clearance 0.2))
(min_thickness 0.2) (min_thickness 0.2)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -6479,7 +6479,7 @@
) )
) )
) )
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5D0BEF97) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5D484672) (hatch edge 0.508)
(connect_pads (clearance 0.2)) (connect_pads (clearance 0.2))
(min_thickness 0.254) (min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))

22
Electronics/EggbotWireless/EggbotWireless.pro
View File

@@ -1,4 +1,4 @@
update=Wed 10 Jul 2019 22:15:33 MSK update=Mon 05 Aug 2019 15:31:54 MSK
version=1 version=1
last_client=kicad last_client=kicad
[general] [general]
@@ -12,16 +12,6 @@ NetIExt=net
version=1 version=1
LibDir= LibDir=
[eeschema/libraries] [eeschema/libraries]
[schematic_editor]
version=1
PageLayoutDescrFile=
PlotDirectoryName=
SubpartIdSeparator=0
SubpartFirstId=65
NetFmtName=
SpiceAjustPassiveValues=0
LabSize=50
ERC_TestSimilarLabels=1
[pcbnew] [pcbnew]
version=1 version=1
PageLayoutDescrFile= PageLayoutDescrFile=
@@ -264,3 +254,13 @@ uViaDrill=0.1
dPairWidth=0.2 dPairWidth=0.2
dPairGap=0.25 dPairGap=0.25
dPairViaGap=0.25 dPairViaGap=0.25
[schematic_editor]
version=1
PageLayoutDescrFile=
PlotDirectoryName=
SubpartIdSeparator=0
SubpartFirstId=65
NetFmtName=
SpiceAjustPassiveValues=0
LabSize=50
ERC_TestSimilarLabels=1

4
Electronics/EggbotWireless/EggbotWireless.sch
View File

@@ -1755,7 +1755,7 @@ L EggbotWireless-rescue:R-Device-Catfi-rescue R21
U 1 1 5D2AE9C7 U 1 1 5D2AE9C7
P 4900 1500 P 4900 1500
F 0 "R21" V 4693 1500 50 0000 C CNN F 0 "R21" V 4693 1500 50 0000 C CNN
F 1 "330" V 4784 1500 50 0000 C CNN F 1 "510" V 4784 1500 50 0000 C CNN
F 2 "Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder" V 4830 1500 50 0001 C CNN F 2 "Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder" V 4830 1500 50 0001 C CNN
F 3 "~" H 4900 1500 50 0001 C CNN F 3 "~" H 4900 1500 50 0001 C CNN
1 4900 1500 1 4900 1500
@@ -1901,7 +1901,7 @@ L EggbotWireless-rescue:R-Device-Catfi-rescue R27
U 1 1 5D304274 U 1 1 5D304274
P 1450 6750 P 1450 6750
F 0 "R27" H 1520 6796 50 0000 L CNN F 0 "R27" H 1520 6796 50 0000 L CNN
F 1 "3K" H 1520 6705 50 0000 L CNN F 1 "2.2K" H 1520 6705 50 0000 L CNN
F 2 "Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder" V 1380 6750 50 0001 C CNN F 2 "Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder" V 1380 6750 50 0001 C CNN
F 3 "~" H 1450 6750 50 0001 C CNN F 3 "~" H 1450 6750 50 0001 C CNN
1 1450 6750 1 1450 6750